Inside informationEnglish
STMicroelectronics announces (i) a US$1.5 billion dual-tranche offering of New Convertible Bonds and (ii) the early redemption of its 2027 Convertible Bonds
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Document type
- Issuer
- Stmicroelectronics NV
- Filed
- 16/06/2026, 07:35
- Document type
- Inside information
- AMF sub-type
- Informations privilégiées
- Language
- English
- AMF reference
- 117934_20260616